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物联网工控机LEO103TLEO 103T

Ultra-Compact Fanless System with Intel® Atom® (Elkhart Lake) Processors

●Intel® Atom® x6413E/x6211E Processors

●GPIO 4-in/4-out & 1x DVI-I & 1x HDMI

●Over/Under/Reverse voltage protection

●Extended operating temperature from -20°C to 70°C

●9V~36V DC wide-range power input

●1x 3042/2242 M.2 B-Key, 1x Micro SD, optional 1x 2.5’’ SSD

●3x Gigabit Ethernet, 3x full-size Mini PCI-E sockets & 2x SIM card slots

●4x COM (RS232/422/485), 2x USB 3.1 & 2x USB 2.0

●Supports DIN-rail mount, wall mount & TPM 2.0

LEO103T是一款超紧凑的物联网网关边缘计算系统，集成了英特尔Atom®x6000E系列处理器(代号为Elkhart Lake)，可提供多达4核的处理器，与以前的版本相比，CPU性能提高了40%，图形性能也得到了改善。该平台基于英特尔10nm技术，适用于工厂自动化、物联网网关、边缘计算和自动控制系统的嵌入式应用。

坚固耐用的LEO103T拥有几个先进的功能，如扩展的工作温度范围-20°C至70°C, 3个千兆以太网端口用于快速有线连接和多协议通信，以及过/欠/反向电压保护。有用的I/O接口包括3042/2242 M.2 B-Key, Micro SD, 4个COM (RS232/422/485)， 2个USB 3.1和2个USB 2.0插座。

此外，低功耗LEO103T支持din导轨和壁挂式安装，板载TPM 2.0硬件安全，确保平台完整性。它可与英特尔®Atom®QC x6413E或英特尔®Atom®DC x6211E，并与2.5"驱动器的额外存储选项。

技术规格

System Mainboard	SL100
CPU Type	Intel® Atom® QC x6413E (1.5GHz/3.0GHz, 1.5MB cache, 9W TDP) Intel® Atom® DC x6211E (1.2GHz/3.0GHz, 1.5MB cache, 6W TDP)
System Speed	Up to 3.0GHz
Memory	1x 4GB DDR4-3200 SO-DIMM, Max. 16GB
Construction	Aluminum & steel
Chassis Color	Sliver (aluminum)
Rear Panel External I/O	1x DVI-I + 1x HDMI 2x USB 3.1 ports, 2x USB 2.0 port 3x RJ45 Gigabit Ethernet port 4x LED indicators (GPIO, WLAN, WWAN) 1x power button with Green LED 1x 3-pin DC-in terminal block for 9V-36V 2x Antenna hole for WLAN module 2x RS232/422/485 ports for COM#3/COM#4 1x 4-in & 4-out GPIO with isolation, 1x Micro SD
Left Panel External I/O	2x RS232/422/485 ports for COM#1/COM#2 1x Antenna hole for WLAN module 1x Line-out/ Mic-in
Right Panel External I/O	2x SIM card slot 1x Antenna hole for WLAN module
Expansion Slots	1x Full-size Mini PCI-E socket (USB 2.0) 2x Full-size Mini PCI-E socket (USB 2.0 + PCI-E) 1x 3042/2242 M.2 B-Key socket (USB 2.0 + PCI-E+SATA)
Storage / M.2	1x 3042/2242 M.2 B-Key socket ,1x 2.5’’ SSD (Optional)
Mounting	DIN-rail mounting (DIN-rail mount kit included) Desktop or wall mounting (wall mount kit included)
Weight	TBD
System Dimensions	218mm(W) x 110mm(D) x 57mm(H) w/ Wall mount kit 8.58”(W) x 4.33”(D) x 2.24”(H)
System Operating Temperature	-20°C~70°C (-4°F~158°F)
System Storage Temperature	-40°C ~ 85°C (-40°F~185°F)
System Relative Humidity	5~90% @ 60°C, (non-condensing)
Shock	Operating: 30G/11 ms Duration Non-operating: 40G/11 ms Duration
Vibration	Operating: 1.0 grms / 5~500Hz
Certification	Prescan

订购信息

LEO103T-6413M	Fanless DIN-rail System supports TPM2.0 w/ Intel® Atom® Processor x6413E, 3x Gigabit Ethernet, 4x COM, w/o Memory, storage, power adaptor
LEO103TS-6413M	Fanless DIN-rail System supports TPM2.0 w/ Intel® Atom® Processor x6413E, 3x Gigabit Ethernet, 4x COM, w/o Memory, storage, power adaptor, w/ 2.5” storage slot
LEO103T-6211M	Fanless DIN-rail System supports TPM2.0 w/ Intel® Atom® Processor x6211E, 3x Gigabit Ethernet, 4x COM, w/o Memory, storage, power adaptor
LEO103TS-6211M	Fanless DIN-rail System supports TPM2.0 w/ Intel® Atom® Processor x6211E, 3x Gigabit Ethernet, 4x COM, w/o Memory, storage, power adaptor, w/ 2.5” storage slot