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第9/8代Intel®内核的强大嵌入式系统™工控机LEO232

Expandable Fanless & Ventless System with 9th/8th Gen Intel® Core™ i7/i5/i3 Desktop Processors (35W TDP)

●Fanless system with IBASE MB230 customized board

●9th/8th Gen Intel® Core™ i7/i5/i3 Desktop Processors

●Dual SIM slots supports WWAN redundancy

●4x RJ45 Gigabit Ethernet port (2x Supports 802.3at PoE+)

●3x M.2 (B-Key/E-Key/M-Key)

●Supports Over/Under/Reverse voltage protection

●iSMART, iAMT (11.6), TPM (2.0)

●Flexible expansion slot system

●2x 2.5" storage (Supports RAID 0/1)

LEO232是一款基于第9/8代Intel®内核的强大嵌入式系统™ ，专为智能工厂、工业自动化、AIoT和恶劣环境中的其他应用而开发，坚固耐用的LEO232提供卓越的计算和图形性能，工作温度范围扩展到-20°C到70°C，工作振动高达3Grms，并提供过/欠/反向电压保护。

LEO230系列内置Intel®Q370 MB230AF主板，并配备多个高速I/O，包括用于NVMe存储、WiFi和4G/LTE选项以及HDMI/DP/DVI-D显示接口的8x USB 3.1、4x COM和3x M.2（B键、E键和M键）。它还具有四个千兆以太网端口，非常适合网络相关应用，iAMT（11.6）用于系统远程管理和修复，TPM（2.0）安全用于防止网络钓鱼攻击，iSMART绿色技术用于电源开/关调度和电源恢复功能。

该系列的所有型号均配备8GB可扩展至32GB的DDR4内存、64GB MLC工业级SSD和12V或18V~24V宽范围直流输入。支持的操作系统有Windows 10（64位）/Windows 7（32位和64位）和Linux Ubuntu/Fedora 24。AMI231和AMI232变体支持可选扩展卡，扩展卡具有PCI、PCIe（x1）、PCIe（x8）、PCIe（x16）、2x COM（COM5和COM6）、1x SATA II和2x USB 2.0。

技术规格：

System Mainboard	LEO230AF with Intel® Q370 PCH
CPU Type	9th/8th Gen Intel® Core™ i7/i5/i3 Desktop Processors
System Speed	Up to 4.00 GHz
Memory	2x DDR4-2666/2400 SO-DIMM, Max. 32GB
Construction	Aluminum & steel
Chassis Color	Silver
Front Panel External I/O	1x RS232/422/485 port for COM#1~COM#2 3x RS232 ports for COM#3~COM#4 2x RS232 ports for COM#5~6 from optional IP211/IP212 1x DisplayPort (1.2) 2x RJ45 Gigabit Ethernet port (Supports 802.3at PoE+) 1x 5-pins DC-in terminal block type for 12V(±10%) or 18V(-10%)~24V(+10%) 2x Antenna holes 2x USB 2.0 from optional IP211/IP212/IP213 2x expansion slot
Rear Panel External I/O	1x DVI-D + HDMI(1.4) 4x USB3.1 ports 2x Antenna holes 2x RJ45 Gigabit Ethernet port + Dual USB3.1 stack ports 1x Red HDD LED 1x power button with Green LED indicator 1x 2-pin terminal block 2x SIM Card
Expansion Slots	IP211/IP212/IP213
Storage / M.2	2x 2.5'' HDD/SSD 1x M.2 (B-KEY Supports USB2.0 for 4G/LTE) 1x M.2 (E-KEY Supports PCIe + USB2.0 for CNVi) 1x M.2 (M-KEY Supports PCIe(4x) + SATA for NVMe SSD)
Mounting	Desktop & wall mount
Weight	4.9 kg
System Dimensions	210mm(W) x 285mm(D) x 129mm(H) 8.27” (W) x 11.22” (D) x 5.08” (H)
System Operating Temperature	-20°C to 70°C (-4°F~158°F) (for 35W CPU)
System Storage Temperature	-20°C~80°C (-4°F~176°F)
System Relative Humidity	5%~90%@45°C (non-condensing)
Shock	Operating : 20G / 11ms Non-operating : 40G / 11ms
Vibration	Operating : 3Grms / 5~500Hz
Certification	CE/ FCC ClassA/ LVD

订购信息：

LEO232AF	Fanless box System with LEO230AF, w/ Intel® Core™ i7/i5/i3 desktop Processor, 6x COM (from IP211/ IP212) 4x COM (from IP213), 1x 8GB memory, 1x 2.5” 64GB MLC industrial-grade SSD, w/o power adaptor, optional riser card
330W Power Adaptor Kit (optional)	330W (24V@13.75A) power adaptor Kit Compatible with IEC62368-1/EN62368-1
Riser card kit (optional)	IP211 (ZM05IP211---0B1000R) w/ COM cable (2x C501PK1H009302A00P) IP212 (ZM05IP212---0A1000R) w/ COM cable (2x C501PK1H009302A00P) IP213 (ZM05IP213---0A1000R) w/o COM cable
Optional Accessories	Global 4G antenna kit for Sierra Wireless EM7565 module, M.2 (M-KEY 2280) Thermal kit